Machine name : Automatic die & clip bond assembly machine CD-CDPCO-CLIP

Applicable products : TO-220, TO-3P, TO-247, GBU, GBJ, GBP

Description : This model provides integrated operations such as substrate screen printing, chip placement, dispensing, clip pick & place, and sintering, etc. for the assembly of bulk bridge-type chip products

LF In-put : Stacking feeder & magazine loader

Die loader : Bulk die shaker & blue film chip

Clip loader : Bulk clip & rolled clip

Out-put : Magazine unloader

Machine size : L5400 × W1600 × H1900mm

Specialty :

1. Equipped with a CCD vision inspection system for100% full inspection of solder paste volume

2. Multi-chip pick-up judgment, adding a material shortage discharge area, improving the utilization rate and quality efficiency of shaker

3. Automatic multi-shaker loading and unloading zone for zonal pick & place with good operability and high safety

4. UPH: 5K-9K/hr

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